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熔湿

网络wetting

熔湿

熔湿

wetting

免洗锡膏标准工艺 - 半导体技术的日志 -... ... 印刷图形的塌落( slump) 熔湿( wetting) 焊锡结珠/锡球( beading/balling) ...

3

Offers good solderability and excellent wettability .

具有良好的可焊性和优异的熔湿性。

4

printing (for 48hours with the same cream ) . , printability and solder ability after long time printing shall be same as initial stage .

由于连续印刷性优异，在长时间连续印刷后（同一锡膏 48 小时），其熔湿性亦可维持和初期一样。

5

Superior wetting performance with lower flux splatter .

优异的熔湿特性，溅污影响更低。

6

Nitrogen like in the tin -lead system will offer smoother solder joints and better wetting will be gained with the use of nitrogen .

与锡 -铅系统类似，氮气可以使焊点更为光滑；使用氮气还可以得到更好的熔湿性。

7

This will result in slower wetting and reduced hole fill .

这会导致熔湿速度减慢，孔隙填充能力降低。

8

Defects such as bridging, non-wetting, de-wetting and the potential for solder balls can increase .

诸如桥接、不熔湿、反熔湿以及发生焊料结球等缺陷的的可能性可能增加。

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