大家在查：安默瓦布 Dynamically Tuned JOCKY TG-DTG 沃尔特·梅 Musumba db2fmps NCCF 赖弗

引线框架

网络Lead Frame; MLF; Leadframe version

引线框架

网络释义

引线框架

Lead Frame

引线框架(Lead Frame)是LED产品的基础组成部分，含氰银电镀及预镀铜打底工艺是LED引线框架生产中必不可少的生产工艺 …

MLF

20世纪90年代开发出微引线框架（MLF）系列封装，MLF接近于芯片级封装（Chip Scale Package，CSP），用封装的底部引 …

Leadframe version

德国MIC小体积F系列 ... -Shock and vibration tested 通过冲击及震动测试 -Leadframe version 引线框架 -Motors 电机、马达 ...

QFP

引线框架(QFP)供应商变更信赖性研讨（LEVEL -3） PCT(HAST) FAIL 3/45ea, TEST Function Fail ;T/C FAIL 1/45ea, Open/Sh…

TO & IC

...家和地区引进的10多台高速精密冲床，专业生产半导体引线框架（TO & IC）、LED端子、连接器等系列产品，年生产能力在3…

例句：

Lead frames , especially those made of copper alloys, are among the most important parts for electronic IC devices.

引线框架材料是电子工业不可或缺的重要组成部分，而铜合金框架材料又占其中的大部分。

C194 copper alloy is one of the representative materials of lead frame .

C194 铜合金是最具代表性的引线框架材料之一。

This results that the lead frame and the detection element have improved electrical connection .

这导致引线框架和检测元件之间的具有改善的电连接状态。

A number of fingers are attached to the lead frame , and one or more electrode contact surfaces are attached to each finger.

多个指状物，每个指状物具有第一端和第二端，每个指状物的第一端附着到所述引线框架；

electrically connecting pads on the surface of the chip with a base pin of the lead frame ;

将芯片表面的焊盘与引线框架的管脚电学连接；

adhering a chip base and a lead frame which are used for encapsulating a chip to the viscous surface of the film ;

将用于封装芯片的芯片基座和引线框架粘附在所述薄膜的粘性表面；

Application Requirements for lead frame Used for IC Plastic encapsulation

集成电路塑封中引线框架使用要求

Technology investigation of KFC copper alloy used for lead frame

KFC 引线框架铜合金带材的生产工艺研究

Progress of Study on Lead Frame Copper Alloy and Its Implementation in Electronic Industry

电子工业用引线框架铜合金及组织的研究

Semiconductor integrated circuits --Specification for stamped leadframes of plastic DIP

半导体集成电路塑料双列封装冲制型引线框架规范

Products Brief Introduction of IC Threadlike Fuse Frame and Die Design and Manufacture

IC 引线框架产品简介及其模具设计和制造

An Investigation on Additives for Lead Frame in High Speed Electroplating for Tin- lead Alloy

引线框架高速锡铅电镀添加剂的研究

Designing and Manufacturing of Integrated Circuit Lead Frame

集成电路引线框架设计制造

The Research Status and Trends of Lead Frame Materials for Integrated Circuits

集成电路用引线框架材料的研究现状与趋势

Numerical analysis of surface flaking in finish rolled lead frame copper alloy

引线框架铜合金精轧薄板表面起皮剥落的数值分析

Study of strip layout in progressive die CAD for IC lead frame based on optimizing rules

基于优化准则的 IC 引线框架级进模工序设计

Oxidation Failure and Mechanism of Lead Frame Copper Alloys for IC Package

IC 铜合金引线框架材料的氧化失效及其机理

Microstructure and Capability Research of KFC Lead Frame

KFC 引线框架材料组织性能研究

Researches and Production Development of Copper Alloy Materials for Lead Frame

引线框架铜合金材料研究及开发进展

Thermal Analysis of Integrated Circuit Lead-Frame

集成电路引线框架的热性能分析

Design of the Progressive Die for the Lead Frame

引线框架级进模设计

Specification of leadframes for plastic leaded chip carrier packages

塑料有引线片式载体封装引线框架规范

Study on Process and Properties of KFC Copper Alloy Strip for Lead Frame

引线框架用 KFC 铜合金带材加工工艺及性能研究

Design of Frame Stepping Mould with Multi -position

引线框架多工位级进模设计

Specification of leadframes for small outline package

小外形封装引线框架规范

Specification of leadframes for plastic quad flat package

塑料四面引线扁平封装引线框架规范

引线框架

引线框架

Lead Frame

MLF

Leadframe version

QFP

TO & IC

热词推荐

大家在看