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electroless

网络化学镀；无电解镍；无电镀的

electroless

网络释义

electroless

化学镀

...的数量。冶金学家们指出仅有化学镀(electroless)将镍沉浸在金的表面处理可以将铜溶解的速率进行限制，这是因为存在有镍 …

无电解镍

镀层厚度检测仪 - 安邦仪器有限公司 ... Chrominum 铬 Electroless 无电解镍 Gold 金 ...

无电镀的

英语新词汇与常用词汇的翻译(44) _ 上海疯狂英语 ... electrokymograph 心脏动态摄影机 electroless 无电镀的 electrolier 电灯架 ...

无电镀铜

...ED) 五、Pumice 前处理后之氧化速率快 无电镀铜(ELECTROLESS) 研磨(SCRUBBED) 六、Etch Bond 浮石喷砂(PUMICED…

化学沉积

... 化香树果序 infructescence of Platycarya Strobilacea Sieb.et Zucc 化学沉积 electroless 化学促渗剂 chemical enhancers ...

无电电镀法

...Deposition，简称CVD）[14,15]及无电电镀法（Electroless）[16,17]沉积铜金属薄膜都有技术上限制，目前的沉积技术皆以 …

无电解电镀

...putter)、电镀(Electroplate)、无电解电镀(Electroless)或CVD等与IC 制程相同的半导体制程，沉积在铜箔上，再利用光阻蚀刻 …

例句：

Is SPC used for Desmear and Electroless process ? Is the corrective action taken for the out of control status?

去胶渣与化学沉铜制程是否使用 SPC ？超出管控要求时，是否采取相应的改善措施？

Electroless plating and salt bath plating were adopted on the surface modifications diamond .

采用化学镀、盐浴镀对金刚石进行表面改性。

It is shown that optimized Ni-P alloy coatings can be obtained with electroless nickel plating on the surface of AZ91 magnesium alloys .

此外研究了化学镀镍时间及镁合金基体镀前热处理工艺对 AZ91 镁合金表面镀层硬度及其与基体的结合力。

and a step in which the core powder having the noble metal deposited thereon is plated by electroless plating .

接着，对载持有该贵金属的芯材粉体进行非电解电镀处理的工序。

Regeneration of electroless Ni bath by electroosmosis was tentatively investigated through static electroosmosis experiment .

通过静态电渗析实验，初步研究了电渗析法对化学镀镍液的再生。

Its products include chemicals used in electrolytic nickel plating, electroless copper, electroless nickel and pretreatment .

产品包括电镍、沉镍、染黑、无氰电铜及前处理。

This method may be readily available for practical purpose since its procedure is simple and uses the conventional electroless plating .

该方法实用易得，因为它过程简单并使用传统的化学镀。

Thus electroless Ni-P plating was used to repair the worn shaft and store the original size and surface precision .

对其采用镍磷化学镀技术修复，恢复至原尺寸和表面精度。

One disclosed example includes an electroless nickel -polytetrafluoroethylene coating .

一个公开的示例包括非电镀的镍 -聚四氟乙烯覆层。

Theoretical analysis and numerical simulation methods for the electroless copper deposition is presented in this paper .

本文采用理论分析和数值模拟的方法模拟化学镀铜的沉积过程。

In addition , the heat treatment of electroless plating coatings can obviously improve their properties .

此外，对碳纳米管化学镀层热处理可以改善镀层的性质。

Described herein is a coating formulation for non-playable grade substrate prior to undergoing an electroless metal plating process .

说明了一种在无电电镀过程之前用于不可电镀的基底的涂层制剂。

Laying basis on this , carried out an improvement experiment on the techniques of the electroless nickel plating on magnesium alloys .

并且以此为基础，对镁合金化学镀镍的工艺进行了改进。

The activation processes for electroless plating on nonmetal substrate at home and abroad were introduced .

介绍了近年来国内外非金属基体化学镀的活化工艺。

electroless

electroless

化学镀

无电解镍

无电镀的

无电镀铜

化学沉积

无电电镀法

无电解电镀

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